Whatsminer H3 CPU BGA Reballing Stencil - Precision Steel Mesh for Allwinner H3 Chip Repair

Professional-Grade Tin Planting Solution for Whatsminer Control Board Restoration

Achieve flawless BGA reballing with our Whatsminer H3 CPU Tin Tool Stencil Plate, engineered for professional-grade repairs of Allwinner H3 chips on mining control boards. This precision laser-cut steel mesh ensures perfect solder ball placement whether you're restoring oxidized pins or preparing new chips for installation.

CNC-Precision Stencil with High-Temp Resistance & Anti-Deformation Design

Key Features & Benefits:
✔ Military-Grade Durability - High-temperature resistant materials withstand repeated reflow cycles
✔ Surgical Precision - CNC-machined holes guarantee perfect solder ball alignment (0.01mm tolerance)
✔ Warp-Free Performance - Special alloy composition prevents expansion/deformation under heat
✔ Optimized Workflow - Engineered demolding design enables clean, effortless separation
✔ Eco-Conscious Manufacturing - Environmentally friendly materials meet ROHS standards

Technical Superiority:
Our stencil outperforms conventional models with its dual-hole design (round + square) that accommodates all BGA solder types. The mirror-polished surface ensures smooth solder paste release, while the reinforced border maintains structural integrity through hundreds of repair cycles.

Pro Tip: For best results, pre-heat the stencil to 80-100°C before application to minimize thermal shock and ensure consistent solder ball formation.

Whatsminer H3 CPU Stencil Specifications: