This BM1360BB tinning stencil plate is a laser-cut stainless steel tool for precision solder paste application when replacing ASIC chips on the Antminer S19i hashboard. The aperture pattern matches the BM1360BB BGA pad layout with ±0.02mm tolerance, withstands temperatures up to 300°C without warping, and features ESD-safe construction to protect sensitive chips during handling. Designed for repeated reflow cycles across hundreds of chip replacements.
Why Precision Stencils Improve First-Pass Yield
Freehand solder paste application on a BGA chip produces inconsistent deposits — bridging, voids and uneven coverage that cause rework. This stencil ensures every aperture receives the correct paste volume in a single scraper pass, producing uniform solder joints across the entire BGA array. The laser-cut stainless steel resists oxidation and maintains aperture accuracy over the stencil's service life.
How to Use
Place the chip or prepared PCB pads face-up. Align the stencil so apertures register with the BGA pads. Apply solder paste with a squeegee in a single pass. Lift vertically. Place the chip on the hashboard footprint and reflow. Clean the stencil with IPA after use.
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