HY883 Grey Thermal Grease 6.5W/m·K – 1kg Industrial Bulk Thermal Paste
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HY883 Grey Thermal Grease 6.5W/mK | 1kg Industrial Bulk Compound for ASIC Hashboard, CPU/GPU & Power-Module Cooling
HY883 Grey Thermal Grease is a 6.5W/mK carbon-nanoscale-enhanced silicone thermal compound supplied in a 1kg industrial can for ASIC mining farms, repair benches, and electronics factories. Engineered for high heat flux applications: blends silicone, carbon, and metal-oxide fillers into a stable paste that does not run, separate, or dry out at sustained 24/7 operating temperatures.
Bulk packaging targets professional users — one 1kg can handles dozens of full hashboard rebuilds, multi-server CPU/GPU retrofits, or industrial-electronics production runs. Predictable thermal impedance, electrical insulation up to 10kV breakdown, and a wide operating window from -20°C to +130°C cover the realistic envelope of ASIC and high-power-converter duty.
Why HY883 for High-Heat-Flux Workloads
- 6.5W/mK thermal conductivity — moves chip heat into the heatsink fast enough for sustained hashboard duty.
- <0.0016 °C·in²/W thermal impedance — minimal temperature drop across the interface itself.
- Electrical insulation >10 000V — safe between live conductors and grounded heatsinks.
- Carbon-nanoscale + silicone + metal-oxide blend — long-term stability, no rapid pump-out or drying.
- 1kg industrial can — production-scale packaging for repair benches and assembly lines.
HY883 Thermal Grease Specifications
| Parameter | Specification |
|---|---|
| Model | HY883 |
| Colour | Grey |
| Thermal Conductivity | > 6.5 W/m·K |
| Thermal Impedance | < 0.0016 °C·in²/W |
| Specific Gravity | > 2.35 g/cm³ |
| Thixotropic Index | 300 ± 10 (1/10 mm) |
| Moment Bearing Temperature | -30°C to 150°C |
| Operating Temperature | -20°C to 130°C |
| Composition | Silicone 30% / Carbon 20% / Metal-Oxide 50% |
| Package | 1kg industrial can |
| Recommended Thickness | 0.13–0.15 mm |
| Condition | Brand New |
FAQ — HY883 Thermal Grease
Q: HY883 vs HY234-CN100 putty — which one for ASIC hashboards?
A: HY883 is a paste for thin, repeatable interfaces on flat lapped surfaces (ASIC die to heatsink, CPU IHS to cooler). HY234-CN100 is a putty for filling visible gaps and uneven step transitions (VRM stacks, memory packages, irregular surfaces). Use the paste where the gap is small and even, the putty where it isn't.
Q: How much paste per hashboard?
A: Apply at the 0.13–0.15 mm thickness target across the chip die. For an Antminer- or Whatsminer-style hashboard with 60–120 ASIC chips, plan on a few grams per board — a 1kg can therefore covers a large fleet rebuild.
Q: Reposition the heatsink after install?
A: Avoid it. Once the heatsink is seated and the paste has spread, lifting introduces air voids that drop effective conductivity. If repositioning is necessary, fully clean the surfaces and re-apply.
Q: Bulk pricing for mining farms and repair benches?
A: Yes — email contact@lys-sz.com for case-quantity HY883 pricing and OEM / private-label options.
Related products
- HY234-CN100 Silicone Thermal Putty 1kg (gap filler)
- Whatsminer KL1040 White Thermal Grease 1kg
- G18 YS346 5.5W/mK Silicone Grease 30cc
- Antminer S21 Silicone Grease Application Tin Tool
Mining farms and repair benches stocking HY883 thermal grease by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.
Shipping & Customs
🇺🇸🇪🇺 USA & European Union (DDP):
Orders are delivered DDP (Delivered Duty Paid). All customs duties, import taxes, and fees are included — no additional charges on delivery.
🌍 Rest of world:
Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes. Any such fees are set by your local authorities and are not included in the product price.
Buying in bulk for a mining farm or repair shop?
Get dedicated B2B pricing on this part and across our full catalog — quote response within 24 hours, payment by T/T USD bank wire, and DDP delivery available for US & EU customers (and other lanes on request).
