MT29F4G08ABADAH4-IT:D 4Gb NAND Flash Memory IC | Industrial-Grade VFBGA-63 Storage for Control Board Repair
The MT29F4G08ABADAH4-IT:D is a high-reliability 4Gb (512MB) NAND Flash memory IC designed for industrial and embedded applications. ONFI 1.0 compliant with a parallel interface — efficient, stable non-volatile storage with high endurance and long data retention. Housed in a compact 63-ball VFBGA package (9×11mm) suitable for automated manufacturing and high-density PCB designs.
Headline reliability specs: endurance up to 100,000 program/erase cycles, 10-year data retention. Operating temp range -40°C to +85°C for industrial-grade duty in harsh environments. Page size 2112 bytes (2048 data + 64 spare); 64 pages per block across 4096 dual-plane blocks. Operating voltage 2.7V to 3.6V.
When You Need the MT29F4G08 NAND Flash
Embedded control board firmware storage — direct replacement when the original chip fails or corrupts.
Industrial system NAND replacement — automotive, networking, or control equipment using the same part.
SSD / memory module rework — repair of storage drives built around this chip family.
End-of-life production runs — keep small stock for products that haven't migrated to newer NAND.
MT29F4G08ABADAH4 Specifications
Parameter
Specification
Part Number
MT29F4G08ABADAH4-IT:D
Memory Type
NAND Flash
Capacity
4Gb (512MB)
Organization
512M × 8
Interface
Parallel (ONFI 1.0)
Page Size
2112 bytes (2048 + 64 spare)
Block Size
64 pages per block
Total Blocks
4096 (dual-plane)
Endurance
100,000 cycles
Data Retention
10 years
Operating Voltage
2.7V to 3.6V
Temperature Range
-40°C to +85°C
Package
63-VFBGA (9×11mm)
Condition
Original / Brand New
FAQ — MT29F4G08ABADAH4 NAND Flash
Q: What's the "-IT:D" suffix about? A: "IT" denotes the industrial temperature grade (-40°C to +85°C), ":D" is the data sheet revision. For commercial-temperature variants the suffix differs. Match the exact part number on your existing chip when ordering replacement — different grades have different reliability windows.
Q: Rework profile for VFBGA-63? A: Requires proper BGA rework station with bottom-side preheat (130-150°C) and controlled top-side hot-air profile. Hand-soldering iron is not suitable for this package. After reflow, X-ray inspection or AOI is the only reliable way to confirm proper ball joints.
Q: Can I substitute a higher-capacity NAND? A: No — the host system reads a fixed memory map based on the original chip's capacity. Higher-capacity chips report different parameters, and the firmware will either reject them or address only the original-spec range. Match exactly.
Q: Bulk pricing for repair facilities? A: Yes — email contact@lys-sz.com for tray-quantity pricing on MT29F4G08 stock.
Repair facilities stocking MT29F4G08 NAND flash by the tray? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.
Shipping & Customs
🇺🇸🇪🇺 USA & European Union (DDP):
Orders are delivered DDP (Delivered Duty Paid). All customs duties, import taxes, and fees are included — no additional charges on delivery.
🌍 Rest of world:
Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes. Any such fees are set by your local authorities and are not included in the product price.
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