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Thermal Paste Gel 5.5W G18 YS346 30CC Silicone-Based Solution for Crypto Miner

$8.00 USD
$8.00 USD
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🇺🇸🇪🇺 USA & European Union: DDP shipping — all import duties & taxes included, no hidden fees.
🌍 Rest of world: Ships from China — local customs fees may apply on delivery.
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About the Product

Thermal Paste Gel 5.5W G18 YS346 – Professional Heat Dissipation for ASIC Miners & GPU Rigs

The G18 YS346 is a professional-grade, silicone-based thermal interface material delivering 5.5 W/m·K conductivity in a convenient 30 CC syringe. Engineered for ASIC miners, GPU rigs and high-power semiconductor assemblies, this non-curing thixotropic gel fills microscopic surface imperfections between heatsinks and heat sources to minimise thermal resistance. Its formulation maintains stable performance across a wide -40 °C to +180 °C operating window, making it suitable for both air-cooled and water-cooled mining installations.

Why Thermal Paste Quality Matters in Mining

ASIC chips in modern miners such as the Antminer S19 or Whatsminer M30 series routinely dissipate 20–40 W per chip, and a single hashboard may carry dozens of them. Poor thermal interface material degrades over time — hardening, cracking or migrating away from the die surface — leading to localised hot spots that throttle hash rate or trigger protective shutdowns. The G18's non-curing formula resists pump-out and dry-out, maintaining a thin, uniform bond line even after thousands of hours of continuous operation.

Application Guide

Clean the heatsink and die surfaces thoroughly with isopropyl alcohol (IPA) and a lint-free cloth before application. For flat ASIC dies, dispense a thin X-pattern across the chip surface and let the heatsink mounting pressure spread the material evenly — avoid over-applying, as excess paste can spill onto nearby SMD components. The 30 CC syringe format works with standard pneumatic dispensers for high-volume rework lines, or can be applied by hand with the included nozzle for individual board repairs. One syringe typically covers 15–25 ASIC chips depending on die size.

For hashboards that use thermal paste stencils (such as the S19 or L7 series), the G18's thixotropic consistency ensures it sits within the stencil openings without bleeding, providing uniform coverage across every chip on the board in a single pass.

G18 YS346 Thermal Paste Specifications

Thermal Conductivity 5.5 W/m·K
Composition Silicone & Thermal Powder
Color Light Pink
Flow Rate 40 g/min @ 90 psi
Minimum Bond Line Thickness 0.08 mm
Density 3.1 g/cm³
Withstand Voltage >5.0 KV/mm
Temperature Range -40°C to 180°C
Shelf Life 9 Months
Package Size 30 ml (30CC) Syringe
RoHS Compliant Yes

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Need bulk pricing for your repair facility or mining farm? Contact us at contact@lys-sz.com — we supply repair centres and mining operations worldwide.

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Shipping & Customs

🇺🇸🇪🇺 USA & European Union (DDP):
Orders are delivered DDP (Delivered Duty Paid). All customs duties, import taxes, and fees are included — no additional charges on delivery.

🌍 Rest of world:
Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes. Any such fees are set by your local authorities and are not included in the product price.

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LYS-SZ

+86 182 1872 0821

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