Whatsminer H3 BGA Reballing Kit - Stencil & Holder Set for Allwinner CPU Repair

Name: Whatsminer H3 BGA Reballing Kit - Stencil & Holder Set for Allwinner CPU Repair
Brand: LYS Shenzhen
Price: 989.0 THB
Availability: InStock

989.00 ฿ THB

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About the Product

Professional-Grade Repair Solution for Whatsminer Control Board CPU Replacement

Revitalize your Whatsminer control boards with our professional H3 BGA Reballing Kit, specifically designed for Allwinner H3 CPU chip repairs. This complete set provides everything needed to replant oxidized pins or apply fresh BGA solder balls with surgical precision, restoring your mining equipment to peak performance.

High-Success-Rate BGA Reballing Kit with Magnetic Base & Precision Alignment

The kit features a three-component system:

Magnetic base for secure workstation setup
Precision positioning plate for chip alignment
High-grade steel mesh stencil for perfect solder ball application

Key Advantages:
✔ 90%+ Success Rate - Optimized design minimizes repair failures
✔ Military-Grade Materials - Withstands repeated high-temperature use
✔ Time-Saving Design - Complete BGA reballing in under 15 minutes
✔ Versatile Application - Works for both oxidized pin repair and new chip installation
✔ Included Expert Tips - Professional techniques for flawless stencil removal

Pro Tip: For easiest operation, remove the stencil while slightly warm to prevent solder paste adhesion and ensure clean separation.

Whatsminer H3 Allwinner CPU Tin Tool Specifications:

Feature	Specification
Compatibility	Allwinner H3 CPU (Whatsminer Control Boards)
Package Includes	1× Magnetic Base, 1× Positioning Plate, 1× Steel Mesh Stencil
Material	Aircraft-grade aluminum base, tempered steel mesh
Operating Temperature	Up to 400°C continuous
Solder Ball Size	0.3mm standard (compatible with most BGA solder pastes)
Dimensions	120mm × 80mm × 25mm (assembled)

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