Enhance Memory Performance with the H5TQ2G63GFR-RDC DDR3 Memory Chip

The H5TQ2G63GFR-RDC is a high-performance 128M FBGA96 DDR3 memory chip designed specifically for the Whatsminer CB2-V8 control board. With its large storage density and high bandwidth capabilities, this memory chip is well-suited for main memory applications that require efficient data storage and retrieval.

The H5TQ2G63GFR-RDC chip supports fully synchronous operation on both the rising and falling edges of the reference clock. This ensures precise data transfer and synchronization, maximizing memory performance and system efficiency.

Large Storage Density and Synchronous Operation for Main Memory Applications

Featuring a fully differential clock input (CK, CK) operation and differential data strobe (DQS, DQS), the H5TQ2G63GFR-RDC chip enables reliable and accurate data transmission. The on-chip DLL (Delay-Locked Loop) aligns DQ, DQS, and DQS transitions with CK transitions, further enhancing data integrity and synchronization.

The H5TQ2G63GFR-RDC chip supports DM (Data Mask) for masking data writes on the rising and falling edges of the data strobe, providing flexibility and control over data operations. All address and control inputs, except data, data strobe, and data mask, are latched on the rising clock edge, ensuring precise timing and synchronization.

With programmable burst length options of 4/8 and nibble order and interleaved modes, this memory chip offers versatility in data access configurations. It also supports dynamic on-chip termination, asynchronous RESET pin, ZQ calibration, and write leveling, providing additional features for optimizing memory performance.

The H5TQ2G63GFR-RDC chip is packaged in a JEDEC standard 96-ball FBGA (x16) package, ensuring compatibility and easy integration into the Whatsminer CB2_V8 control board. The driver strength can be selected through EMRS, allowing for fine-tuning of signal integrity.

Technical Features:

• Fully differential clock input (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• On-chip DLL for precise synchronization
• DM for masking data writes
• Rising edge latching for address and control inputs
• Programmable burst length 4/8 with nibble order and interleaved modes
• Average refresh cycle for commercial and industrial temperature ranges
• JEDEC standard 96-ball FBGA(x16) package
• Driver strength selection through EMRS
• Supports dynamic on-chip termination
• Supports asynchronous RESET pin
• Supports ZQ calibration
• TDQS (Terminate Data Strobe) support (x8 only)
• Supports write leveling