HY268 8.0W/m·K Thermal Putty (100g Tub) for GPU, ASIC & High-Power Electronics

HY268 High-Performance Thermal Putty – 8.0 W/m·K for Professional Cooling Applications

The HY268 Thermal Putty is a premium thermal interface material engineered for high-power electronics, ASIC miners, GPU memory, SSDs, and compact thermal gaps. With a high thermal conductivity of 8.0 W/m·K and ultra-low thermal impedance, HY208 delivers stable and efficient heat transfer where traditional thermal pads are limited.

Designed as a Flexible Alternative to Thermal Pads

Unlike fixed-thickness thermal pads, HY268 thermal putty adapts naturally to uneven surfaces and variable gap sizes, ensuring full contact between heat-generating components and heat sinks. This makes it ideal for ASIC hashboards, GPU RAM modules, mining machines, and compact electronic assemblies.

• High thermal conductivity: ≥ 8.0 W/m·K
• Ultra-low thermal impedance: ≤ 0.021 °C·in²/W
• Excellent formability: replaces thermal pads of multiple thicknesses
• Stable performance: non-drying, non-flowing, long service life
• Safe & compliant: RoHS compliant, electrically insulating

Professional-Grade Solution for Mining & Electronics Repair

HY268 is widely used by mining repair centers, electronics manufacturers, and professional technicians. It is especially suitable for applications requiring reliable heat dissipation across large or irregular contact areas, including GPU RAM, ASIC chips, power modules, wireless charging coils, and SSD controllers.

HY208 Thermal Putty Technical Specifications

B2B & Wholesale Notice: This product is available for bulk orders, OEM supply, and international export. Business pricing and customized shipping solutions are available—please contact our sales team for details.

Quality Assurance: All HY208 thermal putty supplied is original material, subject to strict quality control. Documentation and compliance files can be provided upon request.

Looking for alternative options? For customers with different performance or budget requirements, we also offer other thermal putty and thermal interface materials. Please contact our sales department for recommendations.