HY234 CN100 1kg Silicone Thermal Putty 4.0W/m·K for GPU VRM & ASIC Hash Boards

HY234-CN100 Silicone Thermal Putty 4.0W/m·K for GPU and ASIC Cooling

The HY234-CN100 is a high-quality silicone thermal putty designed for efficient heat transfer on GPU VRM, ASIC hash boards, and high-power electronic components. This pink thermal putty is formulated to fill uneven gaps between heat-generating components and heat sinks, ensuring stable and continuous thermal conduction in demanding environments.

Engineered for long-term reliability, HY234 thermal putty offers low oil separation, excellent thermal stability, and strong resistance to temperature extremes. It is widely used in cryptocurrency mining equipment, industrial electronics, and automotive thermal management applications where traditional thermal pads or pastes are insufficient.

Key Features

• Thermal conductivity greater than 4.0 W/m·K
• Soft, compressible putty for effective gap filling
• Low thermal impedance for improved heat transfer
• Wide operating temperature range for industrial use
• Excellent resistance to aging, oil separation, and weathering
• Suitable for long-term operation on ASIC hash boards and GPUs

Technical Specifications

Typical Applications

• ASIC miner hash boards and ASIC chip surfaces
• GPU VRM and GPU memory cooling
• Cryptocurrency mining machines
• Industrial electronic modules
• Automotive electronic and lighting control systems
• Power conversion and communication equipment

B2B & Wholesale Supply

We operate a dedicated B2B department supporting mining farms, repair centers, distributors, and industrial clients worldwide. Bulk orders, OEM/ODM cooperation, and long-term supply partnerships are welcome. Please contact our sales team for professional inquiries and volume requirements.