Colección: Thermal Paste & Cooling Materials (TIMs)

Thermal Interface Materials (TIMs) for ASIC Miners, GPUs & Electronic Devices

Our selection of thermal pastes, thermal pads, thermal putty, heatsink compounds, and thermal adhesives is designed to improve heat transfer and ensure stable performance across a wide range of electronic devices. Whether you are maintaining ASIC miners, GPUs, CPUs, LED drivers, power supplies, or industrial electronics, high-quality thermal interface materials are essential for preventing overheating and extending hardware lifespan.

Why Thermal Interface Materials Are Important

Thermal paste and other TIM products fill microscopic gaps between a heat source (chipset, processor, MOSFET, etc.) and the heatsink. This results in:

• More efficient heat conduction
• Lower operating temperatures
• Improved device stability under load
• Longer component lifespan
• Reduced risk of thermal throttling or failure

Applications

• CPU & GPU chipsets
• ASIC miners (Antminer, Whatsminer, Avalon, Iceriver, etc.)
• LED lighting modules
• Power supply units and MOSFET cooling
• Smartphones and tablets
• Industrial electronic components

Available Thermal Products

• High-performance thermal paste / heatsink compound
• Silicone thermal pads in multiple thicknesses
• Gap-filling thermal putty
• Thermally conductive adhesive glue
• Pre-cut thermal strips for ASIC hashboards

Tip: For best performance, thermal paste should be applied in a thin, even layer (ideal thickness: 0.13–0.15 mm) to maximize heat transfer efficiency.