Whatsminer H3 BGA Reballing Kit - Stencil & Holder Set for Allwinner CPU Repair
Couldn't load pickup availability
Have questions about this product? Our team is here to help — just reach out on WhatsApp.
💬 Contact Us on WhatsAppAbout the Product
Whatsminer H3 BGA Reballing Kit | Magnetic Base + Stencil + Holder Set for Allwinner H3 CPU Chip-Level Control Board Repair
The Whatsminer H3 BGA Reballing Kit is a complete chip-level rework fixture for Allwinner H3 CPU repair on Whatsminer control boards. Three-component system (magnetic base + precision positioning plate + high-grade steel mesh stencil) lets a bench tech replant oxidised solder balls or apply fresh BGA balls on a salvaged CPU with surgical precision — restoring control-board functionality without swapping the entire board.
Why this matters for Whatsminer fleet repair: the Allwinner H3 CPU is the brain of older Whatsminer control boards, and BGA solder-ball oxidation is one of the dominant failure modes after years of operation in hot mining shed environments. Reballing recovers the CPU itself — much cheaper than full control board replacement when the chip is otherwise healthy.
Kit Contents
- Magnetic base — secure workstation setup, holds the work in place during stencil swap
- Precision positioning plate — chip alignment to the stencil aperture array
- High-grade steel mesh stencil — 1:1 aperture pattern for the Allwinner H3 ball footprint
Why Use This Kit
- 90%+ success rate — optimised design minimises rework failures vs freehand reballing
- Tempered steel mesh + aircraft-grade aluminum base — survives repeated high-temperature cycles
- Complete BGA reball in ~15 minutes — fast bench throughput once the workflow is dialled in
- Dual purpose — fixes oxidised pins on existing CPUs AND prepares new CPUs for install
- Pro tip included — remove the stencil while slightly warm to prevent solder paste adhesion
Whatsminer H3 BGA Reballing Kit Specifications
| Feature | Specification |
|---|---|
| Compatibility | Allwinner H3 CPU (Whatsminer control boards) |
| Kit Type | BGA reballing fixture (3-component) |
| Components | 1 × magnetic base + 1 × positioning plate + 1 × steel mesh stencil |
| Base Material | Aircraft-grade aluminum |
| Stencil Material | Tempered steel mesh |
| Operating Temperature | Up to 400°C continuous |
| Solder Ball Size | 0.3mm standard (compatible with most BGA solder pastes) |
| Assembled Dimensions | 120 × 80 × 25 mm |
| Reusability | Designed for repeated rework cycles |
| Time per Repair | ~15 minutes (skilled bench) |
| Condition | Brand New |
FAQ — Whatsminer H3 BGA Reballing Kit
Q: Will this kit work for other Allwinner H3 boards (not Whatsminer)?
A: Yes — the stencil aperture pattern is matched to the Allwinner H3 chip footprint itself, not to the Whatsminer board layout. Any device using the Allwinner H3 BGA package can be reballed with this kit.
Q: What solder paste do I use?
A: Standard BGA solder paste with 0.3mm ball size matching the stencil apertures. Lead-free SAC305 is the common modern choice; leaded SnPb still works for legacy boards. Match the paste to the CPU's original construction.
Q: Reflow profile after stencilling?
A: Bottom-side preheat 130–150°C with IR or hot plate, top-side hot air 320°C ramped slowly, brief peak above the solder paste's melting point (217°C for SAC305, 183°C for SnPb), then controlled cool-down. Match the paste manufacturer's profile. After reflow, X-ray inspection confirms ball-joint quality.
Q: Bulk pricing for Whatsminer repair benches?
A: Yes — email contact@lys-sz.com for kit-quantity pricing on H3 BGA reballing tooling.
Related products
- Whatsminer KF1978E Stencil Tin Fixture (M50S / M60S)
- BY2020 Digital Pre-Heating Table
- T-8280 IR Preheating Station (1600W bench)
- QUICK 885 Hot Air Gun (hashboard rework)
Whatsminer repair benches stocking H3 BGA reballing kits? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.
Buying in bulk for a mining farm or repair shop?
Get dedicated B2B pricing on this part and across our full catalog — quote response within 24 hours, payment by T/T USD bank wire, and DDP delivery available for US & EU customers (and other lanes on request).
