MT29F4G08ABADAH4-IT:D 4Gb NAND Flash Memory IC | Industrial-Grade VFBGA-63 Storage for Control Board Repair
The MT29F4G08ABADAH4-IT:D is a high-reliability 4Gb (512MB) NAND Flash memory IC designed for industrial and embedded applications. ONFI 1.0 compliant with a parallel interface — efficient, stable non-volatile storage with high endurance and long data retention. Housed in a compact 63-ball VFBGA package (9×11mm) suitable for automated manufacturing and high-density PCB designs.
Headline reliability specs: endurance up to 100,000 program/erase cycles, 10-year data retention. Operating temp range -40°C to +85°C for industrial-grade duty in harsh environments. Page size 2112 bytes (2048 data + 64 spare); 64 pages per block across 4096 dual-plane blocks. Operating voltage 2.7V to 3.6V.
When You Need the MT29F4G08 NAND Flash
Embedded control board firmware storage — direct replacement when the original chip fails or corrupts.
Industrial system NAND replacement — automotive, networking, or control equipment using the same part.
SSD / memory module rework — repair of storage drives built around this chip family.
End-of-life production runs — keep small stock for products that haven't migrated to newer NAND.
MT29F4G08ABADAH4 Specifications
Parameter
Specification
Part Number
MT29F4G08ABADAH4-IT:D
Memory Type
NAND Flash
Capacity
4Gb (512MB)
Organization
512M × 8
Interface
Parallel (ONFI 1.0)
Page Size
2112 bytes (2048 + 64 spare)
Block Size
64 pages per block
Total Blocks
4096 (dual-plane)
Endurance
100,000 cycles
Data Retention
10 years
Operating Voltage
2.7V to 3.6V
Temperature Range
-40°C to +85°C
Package
63-VFBGA (9×11mm)
Condition
Original / Brand New
FAQ — MT29F4G08ABADAH4 NAND Flash
Q: What's the "-IT:D" suffix about? A: "IT" denotes the industrial temperature grade (-40°C to +85°C), ":D" is the data sheet revision. For commercial-temperature variants the suffix differs. Match the exact part number on your existing chip when ordering replacement — different grades have different reliability windows.
Q: Rework profile for VFBGA-63? A: Requires proper BGA rework station with bottom-side preheat (130-150°C) and controlled top-side hot-air profile. Hand-soldering iron is not suitable for this package. After reflow, X-ray inspection or AOI is the only reliable way to confirm proper ball joints.
Q: Can I substitute a higher-capacity NAND? A: No — the host system reads a fixed memory map based on the original chip's capacity. Higher-capacity chips report different parameters, and the firmware will either reject them or address only the original-spec range. Match exactly.
Q: Bulk pricing for repair facilities? A: Yes — email contact@lys-sz.com for tray-quantity pricing on MT29F4G08 stock.
Repair facilities stocking MT29F4G08 NAND flash by the tray? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.
📦 Shipping & Customs⌄
🇺🇸🇪🇺 USA & European Union (DDP): Orders are delivered DDP. All customs duties, import taxes, and fees are included — no additional charges on delivery.
🌍 Rest of world: Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes.
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Volume tiers
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