The Whatsminer KF1960 Stencil Plate is the dedicated tinning fixture for KF1960 ASIC chip replacement on Whatsminer M30S, M30S+ and M30S++ hashboards. Deposits solder paste uniformly across the chip pad pattern — no solder bridges, no cold joints, no manual paste application that wastes 30 minutes per chip. Drop-in replacement for any KF1960 repair workflow.
Engineered from high-grade stainless steel with laser-cut aperture geometry matching the KF1960 OEM footprint. Survives repeated reflow cycles without deformation, keeping aperture precision consistent across hundreds of chips. Repair shops servicing the M30 generation fleet rely on dedicated stencils for both oxidized chip salvage (re-tinning the existing chip pads) and fresh ASIC installation (depositing paste for a brand-new chip).
When to Use the KF1960 Stencil Plate
Failed KF1960 chip replacement on a M30S / M30S+ / M30S++ hashboard — fresh tinning before reflow.
Oxidized chip salvage — re-tin existing pads on a chip that lost surface conductivity from age or thermal stress.
Volume repair workflow — repair shops running KF1960 swaps at scale benefit from consistent tinning vs manual paste application.
Post-failure board refurbishment — fresh chip installation across multiple KF1960 positions on the same board.
Pre-deployment QC — re-tinning chips on used hashboards before redeployment to ensure clean solder joints.
Survives repeated reflow cycles without deformation
Use Profile
Oxidized chip salvage + fresh ASIC installation
Required Equipment
Solder paste + hot-air rework station (not included)
Condition
Brand New
FAQ — KF1960 Stencil Plate
Q: Why use a dedicated KF1960 stencil vs a generic stencil? A: Generic stencils don't match the KF1960's specific aperture pattern. Result: solder bridges between pads, cold joints, or wasted paste. A dedicated stencil for the exact chip footprint gives consistent, repeatable tinning across the chip and across multiple chips in volume work.
Q: Will it work for M30S++ which uses a higher-spec variant of KF1960? A: Yes — the KF1960 footprint is consistent across M30S, M30S+, and M30S++ generations. The stencil is compatible across the three variants.
Q: What solder paste should I use? A: Standard lead-free solder paste (Sn96.5/Ag3/Cu0.5 or equivalent) sized for fine-pitch BGA reflow. Match your hot-air rework station's reflow profile.
Q: Bulk pricing for repair shops? A: Yes — email contact@lys-sz.com with your monthly volume for tier pricing on multiple stencils.
Repair shops stocking KF-series stencils by the set? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.
📦 Shipping & Customs⌄
🇺🇸🇪🇺 USA & European Union (DDP): Orders are delivered DDP. All customs duties, import taxes, and fees are included — no additional charges on delivery.
🌍 Rest of world: Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes.
Get dedicated B2B pricing on this part and across our full catalog —
quote response within 24 hours, payment by T/T USD bank wire,
and DDP delivery available for US & EU customers (and other lanes on request).
Volume tiers
DDP for US & EU
T/T USD wire
24h response