BM2380AA Chip Tinning Tool for Antminer KS3 Hashboard ASIC Chips

BM2380AA Chip Tinning Tool | High-Quality Steel Mesh Stencil with Anti-Static Composite Material for BM2380AA ASIC Chip Replacement on Antminer KS3 Hashboards

The BM2380AA Chip Tinning Tool is the dedicated tinning fixture for BM2380AA ASIC chip replacement on Antminer KS3 hashboards — Bitmain's Kadena miner servicing the KS3 generation. Drop-in tool for repair shops servicing KS3 fleets: deposits solder paste uniformly across the BM2380AA pad pattern with no bridges, no cold joints, and consistent results across repeated chip swaps.

Engineered from electricity-resistant and high-temperature-resistant composite materials rather than standard alloy fixtures — significantly more durable under sustained reflow duty and the composite construction prevents charge generation during chip replacement, protecting the BM2380AA's ESD-sensitive gate structures from silent ESD damage. The precisely positioned steel mesh deposits paste only on the targeted pads, eliminating manual paste guesswork.

When to Use the BM2380AA Tinning Tool

• Failed BM2380AA chip replacement on an Antminer KS3 hashboard — fresh tinning before reflow.
• Repair bench volume work — repeatable chip reballing across multiple KS3 boards per shift.
• Post-failure salvage workflow — fresh paste application around a salvaged BM2380AA before reseating.
• Pre-deployment refurbishment — chip-level rework on used KS3 hashboards before redeployment.
• Repair shop standardisation — fixture-driven workflow replaces freelance manual paste application for consistent quality.

BM2380AA Chip Tinning Tool Specifications

FAQ — BM2380AA Tinning Tool

Q: Is the Antminer KS3 different from the Antminer KA3?
A: Yes — KS3 mines Kaspa (KAS) using kHeavyHash algorithm with the BM2380AA chip. KA3 mines Kadena (KDA) using SHA-512 with the BM2110AA chip. Different chips, different stencils — use the BM2380AA stencil for KS3, the BM2110AA stencil for KA3.

Q: Why composite material instead of pure stainless steel?
A: Composite resists thermal stress better than steel alone under sustained reflow cycles. More importantly, the anti-static composite protects the BM2380AA chip's gate structures from ESD damage during placement and reflow — failures from ESD are silent (no visible damage but the chip dies in service) so this matters more than it seems.

Q: What solder paste should I use?
A: Standard lead-free solder paste (Sn96.5/Ag3/Cu0.5 or equivalent) sized for fine-pitch BGA reflow. Match your hot-air rework station's reflow profile.

Q: Bulk pricing for repair shops?
A: Yes — email contact@lys-sz.com with your monthly volume. KS3 fleet operators get multi-stencil discounts.

Related products

• BM2110AA Stencil – Antminer KA3 Hashboard
• Antminer KS3 Thermal Grease Mold
• BM1766AA Stencil – Antminer D9 Hashboard
• BM1760 Stencil – Antminer D3 Hashboard

KS3 repair shops stocking BM2380AA stencils by the set? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.