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Innosilicon T2T T1668B T1668 ASIC Chips Tin Fixture Stencil Plate

$4.50 USD
$4.50 USD
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🌍 Rest of world: Ships from China — local customs fees may apply on delivery.
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About the Product

T1668B / T1668 / T1668A Tin Fixture Stencil Plate 100mm | Solder-Paste Tool for Innosilicon T2T Hashboard ASIC Chip Replacement

The T1668B / T1668 / T1668A tin fixture stencil plate is a 70mm soldering aid for chip-level repair on Innosilicon T2T hashboards. Designed to deposit an even, controlled layer of solder paste over the ASIC chip pad array — reducing bridging, voiding, and solder-starved joints during reflow rework. The same stencil works across the T1668, T1668A, and T1668B chip variants found on T2T-family boards.

Used with a hot-air station or chip-level reflow rework station: place the stencil over the chip footprint, scrape paste across the openings, lift the stencil, place the chip, and reflow. Pad-level precision that hand-tinning with an iron simply cannot match — critical when one repair board carries dozens of identical ASIC sites.

When You Need the T1668B Tin Stencil

  • Replacing a failed T1668 / T1668A / T1668B chip after diagnostics on a T2T hashboard.
  • Re-tinning pads after lifting a dead chip — restores even pad geometry for the next reflow.
  • Salvaging working chips from a scrap hashboard for reuse on a recoverable board.
  • Bench-level repair throughput — speed and consistency improve dramatically over freehand soldering.

T1668B Tin Fixture Stencil Specifications

Item Specification
Part Number T1668B Stencil Plate
Compatible Chips T1668, T1668A, T1668B (Innosilicon T2T family)
Stencil Size 70 mm
Material Tin
Purpose Chip fixture / solder paste deposition
Weight 0.005 kg
Reusability Reusable with proper cleaning between cycles
Compatible Hashboard Innosilicon T2T series
Condition Brand New

FAQ — T1668B Tin Stencil

Q: Which Innosilicon model is this for?
A: T2T-family hashboards using the T1668, T1668A, or T1668B ASIC chip footprint. The chip pad pattern is shared across the three variants, so one stencil covers all three.

Q: Hot air station temperature for reflow?
A: Use the solder paste manufacturer's profile — typically 220–250°C peak with bottom-side preheat at 130–150°C for proper reflow without thermal shock. Always preheat the entire board before applying top-side heat to avoid PCB warping.

Q: Clean the stencil between uses?
A: Yes — wipe with isopropyl alcohol immediately after use. Dried solder paste in the apertures will cause incomplete deposits on the next chip, leading to opens or starved joints.

Q: Bulk pricing for repair benches?
A: Yes — email contact@lys-sz.com for volume pricing on Innosilicon T2T stencils and matched-set rework kits.

Related products

Innosilicon T2T repair benches stocking T1668B tin stencils by the set? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.

📦 Shipping & Customs

🇺🇸🇪🇺 USA & European Union (DDP):
Orders are delivered DDP. All customs duties, import taxes, and fees are included — no additional charges on delivery.

🌍 Rest of world:
Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes.

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