Whatsminer H3 CPU BGA Reballing Stencil – Precision Steel Mesh for Allwinner H3 Repair
This BGA reballing stencil is laser-cut from high-carbon steel with nickel plating for the Allwinner H3 CPU used on Whatsminer control boards. It delivers 0.01mm aperture tolerance for precise solder ball placement, withstands continuous temperatures up to 450°C and features a mirror-polished surface for clean paste release. Dual-hole design (round and square) accommodates multiple BGA solder ball types. RoHS compliant.
Why Precision Stencils Matter for BGA Reballing
Replacing the Allwinner H3 processor requires depositing evenly sized solder balls on every BGA pad. Freehand application produces inconsistent results — oversized balls bridge adjacent pads, undersized balls create voids. A precision stencil ensures each aperture receives the correct solder volume, producing uniform joints across the entire BGA array. The nickel-plated surface resists oxidation across hundreds of reflow cycles, maintaining aperture accuracy over the stencil's service life.
How to Use
Pre-heat the stencil to 80–100°C for optimal paste release. Align the stencil over the prepared chip or PCB pads. Apply solder paste across the surface with a squeegee in a single pass. Lift vertically to leave clean deposits on each pad. Place the chip and reflow. The reinforced borders prevent warping under repeated heating, and the warp-free special alloy maintains registration accuracy even after extended use.
🇺🇸🇪🇺 USA & European Union (DDP): Orders are delivered DDP. All customs duties, import taxes, and fees are included — no additional charges on delivery.
🌍 Rest of world: Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes.
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