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HY234 CN100 1kg Silicone Thermal Putty 4.0W/m·K for GPU VRM & ASIC Hash Boards

$30.00 USD
$30.00 USD
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🇺🇸🇪🇺 USA & European Union: DDP shipping — all import duties & taxes included, no hidden fees.
🌍 Rest of world: Ships from China — local customs fees may apply on delivery.
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About the Product

HY234-CN100 Silicone Thermal Putty 4.0W/mK | 1kg Pink Gap-Filling Compound for GPU VRM, ASIC Hash Boards & High-Power Electronics

HY234-CN100 is a pink silicone thermal putty with >4.0W/mK thermal conductivity, supplied in a 1kg bulk can for GPU VRM stacks, ASIC hashboard chip surfaces, and high-power electronics. Soft and compressible — fills uneven gaps between heat-generating components and heat sinks where a traditional thermal pad cannot conform and a paste is too thin to bridge the step.

Engineered for the conditions that destroy ordinary thermal compounds in mining and industrial duty: stable thermal performance from -50°C to +200°C continuous (instantaneous up to +340°C), low oil separation, strong resistance to aging, and no rapid pump-out under thermal cycling. Pink colour shows clearly when fully spread, eliminating guesswork during application.

Why a Putty Instead of a Paste or a Pad?

  • Fills irregular gaps — VRM stacks, memory packages, and step transitions where thickness varies across the interface.
  • No pump-out under repeated thermal cycling — paste alternatives migrate over time, putty stays in place.
  • Conformable but stable — soft enough to fill the gap on assembly, stiff enough to hold position once in place.
  • RoHS / CE / SVHC / MSDS certified — ready for industrial and commercial deployment.
  • 1kg bulk packaging — economical for hashboard fleet rebuilds and OEM use.

HY234-CN100 Thermal Putty Specifications

Parameter Specification
Product Model HY234-CN100
Colour Pink
Form Silicone putty (soft, compressible)
Thermal Conductivity > 4.0 W/m·K
Thermal Impedance < 0.028 °C·in²/W
Operating Temperature -50°C to +200°C continuous
Instantaneous Temperature -50°C to +340°C
Specific Gravity > 2.75 g/cm³
Net Weight 1000g (1kg)
Material Silicone
Certifications RoHS, CE, SVHC, MSDS
Condition Brand New

FAQ — HY234-CN100 Thermal Putty

Q: Putty vs paste — which one for ASIC hashboards?
A: Use putty (HY234-CN100) where the gap is large or uneven — VRM stacks, memory blocks, multi-step surfaces. Use paste (HY883 or KL1040) where the chip die is flat and lapped against the heatsink with minimal gap. Many hashboard rebuilds use both: paste on the ASIC dies, putty on the surrounding components.

Q: Application thickness?
A: Apply slightly thicker than the gap so the putty compresses to fill it fully. After assembly, it should be visibly squeezed out around the edges — that confirms full contact. Excess can be trimmed.

Q: Does the pink colour fade over time?
A: The silicone matrix is stable up to 200°C continuous, well within ASIC operating temperatures. Colour stays consistent across the lifetime of normal hashboard duty.

Q: Bulk pricing for repair benches and mining farms?
A: Yes — email contact@lys-sz.com for case-quantity HY234-CN100 pricing and OEM / private-label options.

Related products

Mining farms and repair benches stocking HY234-CN100 thermal putty by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.

📦 Shipping & Customs

🇺🇸🇪🇺 USA & European Union (DDP):
Orders are delivered DDP. All customs duties, import taxes, and fees are included — no additional charges on delivery.

🌍 Rest of world:
Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes.

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