HY234 CN100 1kg Silicone Thermal Putty 4.0W/m·K for GPU VRM & ASIC Hash Boards
Couldn't load pickup availability
Have questions about this product? Our team is here to help — just reach out on WhatsApp.
💬 Contact Us on WhatsAppAbout the Product
HY234-CN100 Silicone Thermal Putty 4.0W/mK | 1kg Pink Gap-Filling Compound for GPU VRM, ASIC Hash Boards & High-Power Electronics
HY234-CN100 is a pink silicone thermal putty with >4.0W/mK thermal conductivity, supplied in a 1kg bulk can for GPU VRM stacks, ASIC hashboard chip surfaces, and high-power electronics. Soft and compressible — fills uneven gaps between heat-generating components and heat sinks where a traditional thermal pad cannot conform and a paste is too thin to bridge the step.
Engineered for the conditions that destroy ordinary thermal compounds in mining and industrial duty: stable thermal performance from -50°C to +200°C continuous (instantaneous up to +340°C), low oil separation, strong resistance to aging, and no rapid pump-out under thermal cycling. Pink colour shows clearly when fully spread, eliminating guesswork during application.
Why a Putty Instead of a Paste or a Pad?
- Fills irregular gaps — VRM stacks, memory packages, and step transitions where thickness varies across the interface.
- No pump-out under repeated thermal cycling — paste alternatives migrate over time, putty stays in place.
- Conformable but stable — soft enough to fill the gap on assembly, stiff enough to hold position once in place.
- RoHS / CE / SVHC / MSDS certified — ready for industrial and commercial deployment.
- 1kg bulk packaging — economical for hashboard fleet rebuilds and OEM use.
HY234-CN100 Thermal Putty Specifications
| Parameter | Specification |
|---|---|
| Product Model | HY234-CN100 |
| Colour | Pink |
| Form | Silicone putty (soft, compressible) |
| Thermal Conductivity | > 4.0 W/m·K |
| Thermal Impedance | < 0.028 °C·in²/W |
| Operating Temperature | -50°C to +200°C continuous |
| Instantaneous Temperature | -50°C to +340°C |
| Specific Gravity | > 2.75 g/cm³ |
| Net Weight | 1000g (1kg) |
| Material | Silicone |
| Certifications | RoHS, CE, SVHC, MSDS |
| Condition | Brand New |
FAQ — HY234-CN100 Thermal Putty
Q: Putty vs paste — which one for ASIC hashboards?
A: Use putty (HY234-CN100) where the gap is large or uneven — VRM stacks, memory blocks, multi-step surfaces. Use paste (HY883 or KL1040) where the chip die is flat and lapped against the heatsink with minimal gap. Many hashboard rebuilds use both: paste on the ASIC dies, putty on the surrounding components.
Q: Application thickness?
A: Apply slightly thicker than the gap so the putty compresses to fill it fully. After assembly, it should be visibly squeezed out around the edges — that confirms full contact. Excess can be trimmed.
Q: Does the pink colour fade over time?
A: The silicone matrix is stable up to 200°C continuous, well within ASIC operating temperatures. Colour stays consistent across the lifetime of normal hashboard duty.
Q: Bulk pricing for repair benches and mining farms?
A: Yes — email contact@lys-sz.com for case-quantity HY234-CN100 pricing and OEM / private-label options.
Related products
- HY883 Grey Thermal Grease 1kg (paste alternative)
- Whatsminer KL1040 White Thermal Grease 1kg
- G18 YS346 5.5W/mK Silicone Grease 30cc
- Antminer S21 Silicone Grease Application Tin Tool
Mining farms and repair benches stocking HY234-CN100 thermal putty by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.
📦 Shipping & Customs ⌄
🇺🇸🇪🇺 USA & European Union (DDP):
Orders are delivered DDP. All customs duties, import taxes, and fees are included — no additional charges on delivery.
🌍 Rest of world:
Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes.

Buying in bulk for a mining farm or repair shop?
Get dedicated B2B pricing on this part and across our full catalog — quote response within 24 hours, payment by T/T USD bank wire, and DDP delivery available for US & EU customers (and other lanes on request).


