HY883 Grey Thermal Grease 6.5W/m·K – 1kg Industrial Bulk Thermal Paste
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HY883 Grey Thermal Grease 6.5W/mK | 1kg Industrial Bulk Compound for ASIC Hashboard, CPU/GPU & Power-Module Cooling
HY883 Grey Thermal Grease is a 6.5W/mK carbon-nanoscale-enhanced silicone thermal compound supplied in a 1kg industrial can for ASIC mining farms, repair benches, and electronics factories. Engineered for high heat flux applications: blends silicone, carbon, and metal-oxide fillers into a stable paste that does not run, separate, or dry out at sustained 24/7 operating temperatures.
Bulk packaging targets professional users — one 1kg can handles dozens of full hashboard rebuilds, multi-server CPU/GPU retrofits, or industrial-electronics production runs. Predictable thermal impedance, electrical insulation up to 10kV breakdown, and a wide operating window from -20°C to +130°C cover the realistic envelope of ASIC and high-power-converter duty.
Why HY883 for High-Heat-Flux Workloads
- 6.5W/mK thermal conductivity — moves chip heat into the heatsink fast enough for sustained hashboard duty.
- <0.0016 °C·in²/W thermal impedance — minimal temperature drop across the interface itself.
- Electrical insulation >10 000V — safe between live conductors and grounded heatsinks.
- Carbon-nanoscale + silicone + metal-oxide blend — long-term stability, no rapid pump-out or drying.
- 1kg industrial can — production-scale packaging for repair benches and assembly lines.
HY883 Thermal Grease Specifications
| Parameter | Specification |
|---|---|
| Model | HY883 |
| Colour | Grey |
| Thermal Conductivity | > 6.5 W/m·K |
| Thermal Impedance | < 0.0016 °C·in²/W |
| Specific Gravity | > 2.35 g/cm³ |
| Thixotropic Index | 300 ± 10 (1/10 mm) |
| Moment Bearing Temperature | -30°C to 150°C |
| Operating Temperature | -20°C to 130°C |
| Composition | Silicone 30% / Carbon 20% / Metal-Oxide 50% |
| Package | 1kg industrial can |
| Recommended Thickness | 0.13–0.15 mm |
| Condition | Brand New |
FAQ — HY883 Thermal Grease
Q: HY883 vs HY234-CN100 putty — which one for ASIC hashboards?
A: HY883 is a paste for thin, repeatable interfaces on flat lapped surfaces (ASIC die to heatsink, CPU IHS to cooler). HY234-CN100 is a putty for filling visible gaps and uneven step transitions (VRM stacks, memory packages, irregular surfaces). Use the paste where the gap is small and even, the putty where it isn't.
Q: How much paste per hashboard?
A: Apply at the 0.13–0.15 mm thickness target across the chip die. For an Antminer- or Whatsminer-style hashboard with 60–120 ASIC chips, plan on a few grams per board — a 1kg can therefore covers a large fleet rebuild.
Q: Reposition the heatsink after install?
A: Avoid it. Once the heatsink is seated and the paste has spread, lifting introduces air voids that drop effective conductivity. If repositioning is necessary, fully clean the surfaces and re-apply.
Q: Bulk pricing for mining farms and repair benches?
A: Yes — email contact@lys-sz.com for case-quantity HY883 pricing and OEM / private-label options.
Related products
- HY234-CN100 Silicone Thermal Putty 1kg (gap filler)
- Whatsminer KL1040 White Thermal Grease 1kg
- G18 YS346 5.5W/mK Silicone Grease 30cc
- Antminer S21 Silicone Grease Application Tin Tool
Mining farms and repair benches stocking HY883 thermal grease by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouse.
Buying in bulk for a mining farm or repair shop?
Get dedicated B2B pricing on this part and across our full catalog — quote response within 24 hours, payment by T/T USD bank wire, and DDP delivery available for US & EU customers (and other lanes on request).
