HY268 Thermal Putty 8.0W/m·K (80g Cartridge) for ASIC, GPU & Power Electronics

HY268 High-Performance Thermal Putty for ASIC & Electronics Cooling

The HY268 Thermal Putty is a high-performance thermal interface material designed for applications where traditional thermal grease or pads are not suitable. With a thermal conductivity above 8.0 W/m·K, it provides excellent heat transfer while maintaining strong gap-filling capability.

This thermal putty is widely used in ASIC miners, GPU memory (VRAM), SSDs, power electronics, and compact electronic assemblies, where uneven surfaces or variable gaps require a flexible and stable thermal solution.

Optimized for Gap Filling & Automated Dispensing

HY268 features a controlled thixotropic index, allowing it to remain stable after application without flow or separation. The 30cc cartridge packaging makes it suitable for both manual application and automated dispensing machines, making it ideal for professional repair workshops and production lines.

Unlike thermal pads, HY268 adapts precisely to component height differences, ensuring consistent thermal contact and reducing hotspot formation.

HY268 Thermal Putty – Technical Specifications

Typical Applications

• ASIC miners and hashboard thermal gap filling
• GPU VRAM and memory module cooling
• High-performance SSD thermal management
• Wireless charging modules
• Power conversion and control electronics

B2B Supply & Quality Assurance

HY268 thermal putty is supplied as an original product and is suitable for professional use. Each batch undergoes quality inspection to ensure stable performance and consistency.

Bulk orders, factory supply, and export shipping options are available. Please contact our sales team for business pricing and logistics solutions.