HY268 Thermal Putty 8.0W/m·K (80g Cartridge) for ASIC, GPU & Power Electronics
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HY268 Thermal Putty 8.0W/mK — 80g Cartridge for ASIC, GPU & Power Electronics
The HY268 thermal putty is a gap-filling thermal interface material rated at thermal conductivity above 8.0W/mK, designed for applications where traditional thermal grease or pre-cut pads fall short. Packaged in an 80g / 30cc cartridge, it bridges uneven contact surfaces and variable component heights with stable thermal contact and no flow under thermal cycling.
HY268 is well suited to ASIC miner hashboards, GPU VRAM, SSDs, wireless charging modules and power conversion electronics. The controlled thixotropic index (185 / 0.1mm) keeps the putty in place after dispensing, while the cartridge format supports both manual application and automated dispensing machines on production and refurbishment lines.
Specifications
| Parameter | Value |
|---|---|
| Model | HY268 |
| Condition | New |
| Type | Thermal putty (gap filler) |
| Color | Grey (other colors available on request) |
| Thermal conductivity | > 8.0W/mK |
| Thermal impedance | < 0.021 °C·in²/W |
| Specific gravity | > 2.75 g/cm³ |
| Thixotropic index | 185 (1/10 mm) |
| Operating temperature | -20°C to 150°C |
| Package | 80g / 30cc cartridge |
Compatibility
HY268 is a general-purpose thermal gap filler — not tied to a specific miner model. Typical mining applications include ASIC hashboard chip-to-heatsink gap filling, VRM and PMIC thermal interface on control boards, and SSD / memory module cooling. The cartridge format fits standard 30cc dispenser guns used across repair workshops.
Where HY268 fits in repair workflow
Use HY268 wherever there is a measurable gap between a heat-generating chip and its heatsink that grease cannot bridge — for instance worn or warped hashboard heatsinks, uneven solder joints, or stacked SMD components under a single sink. Apply a controlled bead with the cartridge, mount the heatsink, and the putty deforms to fill the gap without flowing out under sustained load.
Common failure symptoms that point to a TIM swap
- Hashboard chip temps rising over time despite clean fans and airflow
- Dried, cracked or pulverised grease on disassembled heatsinks
- Hot spots on the thermal camera at the chip-heatsink junction
- Miner throttling on temperature error before reaching rated hashrate
- VRM or PMIC overtemperature shutdowns on control boards
Frequently asked questions
What's the difference between HY268 putty and HY880 thermal grease?
HY880 is a high-conductivity carbon-enhanced thermal grease (>5.15W/mK) for tight chip-to-heatsink contact. HY268 is a putty (>8.0W/mK) for bridging measurable gaps where grease would squeeze out. Use HY880 on flat ASIC chips, HY268 where there is a real gap to fill.
Can HY268 be applied with an automated dispenser?
Yes — the 30cc cartridge is the standard format for both manual handguns and inline automated dispensing on repair production lines.
Is HY268 electrically conductive?
No — see specifications panel for dielectric behavior. As with any TIM, avoid bridging exposed pads or component legs to prevent shorting.
How long does HY268 stay stable in the cartridge?
The thixotropic structure resists drying and separation over time when stored capped at room temperature. Re-cap immediately after each use to maximise shelf life.
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Contact contact@lys-sz.com for volume pricing or compatibility questions. Worldwide shipping from our Shenzhen warehouses. DDP available for US and EU customers.
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