HY236 Pink Thermal Putty 6.0W/m·K – 80g Thermal Interface for ASIC, GPU & Electronics

HY236 Thermal Putty 6.0 W/m·K – High-Performance Interface for ASIC & GPU Cooling

Standard thermal pads cannot conform to the uneven component surfaces found on many ASIC hashboards and GPUs. The HY236 thermal putty solves this — it moulds to irregular gaps and delivers 6.0 W/m·K thermal conductivity, keeping hot spots under control during 24/7 mining or compute workloads. Supplied in an 80 g cartridge for precise, mess-free application.

Gap-Filling Thermal Interface for Miner & GPU Repair

Whether you are re-padding an Antminer S19 hashboard or re-doing the thermal solution on a GPU riser, the HY236 fills thickness variations that rigid pads leave as air gaps. Its putty-like consistency stays in place after curing, providing stable long-term thermal transfer without pump-out — even under the vibration and heat cycling of a mining farm environment.

HY236 Thermal Putty Specifications

Related Thermal Interface Materials

• HY268 Thermal Putty 8 W/m·K – Higher Conductivity
• HY234 Thermal Putty 4 W/m·K – Budget Option
• HY256 Thermal Putty 6 W/m·K
• HY234 Thermal Putty 100 g – Bulk Cartridge

Need thermal materials in bulk for your repair lab? Contact us at contact@lys-sz.com for volume pricing and sample requests.

Worldwide shipping from our Shenzhen warehouse.