HY234 4 W/m·K Pink Thermal Putty 100g for GPU, CPU & ASIC Miners
The HY234 thermal putty is a pink silicone-based heat transfer compound designed for efficient thermal management in GPUs, CPUs, and cryptocurrency mining machines. Optimized for uneven surfaces and wide bond lines where traditional thermal pads or pastes don't seat properly. This 100g jar sizing is the workhorse format for repair shops and small mining farms — enough material for hundreds of repair operations.
Delivers 4 W/m·K thermal conductivity with low 0.028 °C·in²/W thermal impedance. Stable across -20°C to +150°C operating range. Soft silicone formulation for easy application and rework — no rapid drying. Specific gravity 3.05 g/cm³.
Key Features & Benefits
4 W/m·K thermal conductivity for stable heat transfer.
Excellent gap-filling capability for uneven components.
Low thermal impedance (0.028 °C·in²/W) for efficient dissipation.
Soft silicone formulation for easy application and rework.
Stable performance across wide operating temperature range.
100g jar packaging for repair-bench economics.
HY234 100g Thermal Putty Specifications
Parameter
Specification
Model Number
HY234
Color
Pink
Package
100g jar
Thermal Conductivity
4 W/m·K
Thermal Impedance
0.028 °C·in²/W
Specific Gravity
3.05 g/cm³
Operating Temperature
-20°C to +150°C
Electrical Behavior
Electrically insulating
Typical Applications
GPU / CPU / ASIC mining / electronics cooling
Condition
Brand New
FAQ — HY234 Thermal Putty 100g
Q: HY234 vs HY256 vs HY268 — which to choose? A: HY234 (4 W/m·K) is the cost-effective entry-level workhorse. HY256 (6 W/m·K) is the mid-tier for tighter thermal budgets. HY268 (8 W/m·K) is the premium tier for high-power ASIC chips and dense GPU memory arrays. Pick HY234 for general repair, HY256 / HY268 for performance-critical applications.
Q: 100g jar vs 80g tube — which packaging is right? A: 100g jar is wide-mouth — easier to dip applicators and spatulas. 80g tube applies via direct extrusion onto components. Repair shops often stock both: jar for bulk application, tube for precision dots / lines.
Q: How does putty differ from thermal grease / paste? A: Grease / paste is liquid-like, designed for very thin bond lines (chip to heatsink). Putty is moldable, designed for thick / variable bond lines and gap-filling (VRMs, RAM, mismatched component heights). Use the right material for the geometry.
Q: Bulk pricing for repair shops? A: Yes — email contact@lys-sz.com with your monthly volume for tier pricing on HY234 100g jars.
Repair shops stocking HY234 100g jars by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouses.
📦 Shipping & Customs⌄
🇺🇸🇪🇺 USA & European Union (DDP): Orders are delivered DDP. All customs duties, import taxes, and fees are included — no additional charges on delivery.
🌍 Rest of world: Orders ship from China. Depending on your country, local customs authorities may apply import duties or taxes.
Get dedicated B2B pricing on this part and across our full catalog —
quote response within 24 hours, payment by T/T USD bank wire,
and DDP delivery available for US & EU customers (and other lanes on request).
Volume tiers
DDP for US & EU
T/T USD wire
24h response