HY234 4.0W/m·K Pink Thermal Putty (80g Tube) for GPU RAM, ASIC & Electronics

HY234 4 W/m·K Pink Thermal Putty 80g Tube for GPU RAM & ASIC

The HY234 Thermal Putty is a professional-grade thermal interface material designed to replace traditional thermal pads in applications requiring flexible gap filling and reliable heat transfer. With thermal conductivity ≥ 4.0 W/m·K, HY234 offers stable thermal performance for GPU RAM, ASIC miners, smart devices, and electronic modules.

Unlike fixed-size thermal pads, HY234 thermal putty adapts easily to different component heights and surface irregularities. This ensures consistent contact between heat sources and heat sinks, improving cooling efficiency while simplifying installation. The 80g tube format is the bench-standard packaging — direct extrusion onto components, no extra applicators needed (vs the 100g jar format for higher-volume operations).

Key Features

• Thermal conductivity: ≥ 4.0 W/m·K.
• Low thermal impedance: ≤ 0.028 °C·in²/W.
• Excellent formability: suitable for uneven surfaces.
• Electrically insulating: safe for sensitive components.
• Stable material: non-drying, long service life.
• 80g tube format: precision direct extrusion onto components.

Typical Applications

Widely used by mining repair centers, electronics workshops, and OEM assemblers. Typical applications include GPU memory cooling, ASIC hashboards, smart phones, wireless charging modules, and compact electronic devices.

HY234 80g Tube Specifications

FAQ — HY234 Thermal Putty 80g Tube

Q: 80g tube vs 100g jar — which packaging is right?
A: 80g tube is precision — direct extrusion onto specific components (GPU memory chips, small VRMs). 100g jar is for bulk application — dip with spatula or applicator for large areas. Repair shops often stock both: tube for fine work, jar for bulk repasting.

Q: 1 kg bulk version available?
A: Yes — HY234-CN100 is the 1 kg industrial bulk format for high-volume mining repair operations. Same chemistry, same 4 W/m·K conductivity, just larger packaging at lower per-gram cost.

Q: Putty vs grease — when to use putty?
A: Grease is liquid-like, designed for very thin bond lines (chip die to heatsink, <0.2mm). Putty is moldable, designed for thick / variable bond lines and gap-filling (GPU RAM, VRMs, mismatched component heights, 0.5mm+). Pick by geometry: thin gap → grease, thick / variable gap → putty.

Q: Bulk pricing for repair shops?
A: Yes — email contact@lys-sz.com with your monthly volume for tier pricing on HY234 80g tubes.

Related products

• HY234 Thermal Putty 100g Jar – 4 W/m·K Pink
• HY256 Thermal Putty 80g – 6 W/m·K Green
• HY268 Thermal Putty 100g – 8 W/m·K
• HY234-CN100 Pink Silicone Putty 4 W/m·K 1 kg

Repair shops stocking HY234 80g tubes by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouses.