HY268 8.0W/m·K Thermal Putty (100g Tub) for GPU, ASIC & High-Power Electronics
Couldn't load pickup availability
Have questions about this product? Our team is here to help — just reach out on WhatsApp.
💬 Contact Us on WhatsAppAbout the Product
HY268 8 W/m·K Premium Thermal Putty 100g for GPU & ASIC Miners
The HY268 Thermal Putty is a premium thermal interface material engineered for high-power electronics, ASIC miners, GPU memory, SSDs, and compact thermal gaps. With 8.0 W/m·K thermal conductivity and ultra-low ≤0.021 °C·in²/W thermal impedance, HY268 delivers stable and efficient heat transfer where traditional thermal pads are limited.
Unlike fixed-thickness thermal pads, HY268 thermal putty adapts naturally to uneven surfaces and variable gap sizes — ensuring full contact between heat-generating components and heat sinks. Ideal for ASIC hashboards, GPU RAM modules, mining machines, and compact electronic assemblies. 100g tub format supports high-volume repair operations.
Key Features
- High thermal conductivity: ≥ 8.0 W/m·K (top of HY200 series).
- Ultra-low thermal impedance: ≤ 0.021 °C·in²/W.
- Excellent formability: replaces thermal pads of multiple thicknesses.
- Stable performance: non-drying, non-flowing, long service life.
- Safe & compliant: RoHS compliant, electrically insulating.
Typical Applications
HY268 is widely used by mining repair centers, electronics manufacturers, and professional technicians. Especially suitable for applications requiring reliable heat dissipation across large or irregular contact areas: GPU RAM, high-power ASIC chips, power modules, wireless charging coils, SSD controllers.
HY268 100g Thermal Putty Specifications
| Parameter | Specification |
|---|---|
| Model | HY268 (HY200 series) |
| Package | 100g tub |
| Thermal Conductivity | ≥ 8.0 W/m·K |
| Thermal Impedance | ≤ 0.021 °C·in²/W |
| Electrical Behavior | Electrically insulating |
| Material Stability | Non-drying, non-flowing, long service life |
| Compliance | RoHS |
| Use Class | Premium / high-power thermal interface |
| Typical Applications | ASIC miners / GPU RAM / SSD / power modules |
| Condition | Brand New |
FAQ — HY268 Thermal Putty 100g
Q: When is HY268 worth the premium over HY256 / HY234?
A: HY268 makes the difference when you're cooling high-power-density components — modern flagship GPUs (RTX 4090, RX 7900), latest ASIC hashboards (S21, M60), or high-power SSD controllers. The lower thermal impedance (0.021 vs 0.025-0.028) translates directly into a few degrees lower junction temperature — meaningful for thermally-throttled hardware.
Q: HY268 in HY200 family — what does that mean?
A: The HY200 series is the premium thermal putty family from this supplier — typically higher conductivity, lower impedance, more rigorous QA than the HY100 / HY500 series. HY268 sits at the top of that family at 8 W/m·K.
Q: Will applying HY268 void GPU warranty?
A: Replacing thermal interface material typically voids warranty on most consumer GPUs (manufacturer-specific). For out-of-warranty cards or production-deployed mining GPUs, HY268 is the standard upgrade choice. Always check warranty terms before repasting.
Q: Bulk pricing for OEM / repair shops?
A: Yes — email contact@lys-sz.com with your monthly thermal interface volume for tier pricing on HY268 100g tubs.
Related products
- HY256 Thermal Putty 80g – 6 W/m·K Green
- HY234 Thermal Putty 100g – 4 W/m·K Pink
- HY234 Thermal Putty 80g – 4 W/m·K Pink Tube
- China-Made 8 W/m·K Blue Thermal Gel 1 kg
Repair shops stocking HY268 100g tubs by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouses.
Buying in bulk for a mining farm or repair shop?
Get dedicated B2B pricing on this part and across our full catalog — quote response within 24 hours, payment by T/T USD bank wire, and DDP delivery available for US & EU customers (and other lanes on request).
