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HY256 6 W/m·K Green Thermal Putty 80g Tube for GPU RAM & ASIC
The HY256 Thermal Putty is a high-performance thermal interface material designed for professional electronics cooling applications. With thermal conductivity ≥ 6.0 W/m·K, it provides efficient heat transfer while maintaining excellent flexibility — an ideal replacement for traditional thermal pads on dense electronics.
HY256 thermal putty easily adapts to different gap sizes and component heights, ensuring full surface contact between heat sources and heat sinks. This makes it especially suitable for GPU RAM, ASIC hashboards, mining machines, and compact electronic assemblies. The 80g tube format is the bench-standard packaging — direct extrusion onto components, no extra applicators needed.
Key Features
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Thermal conductivity: ≥ 6.0 W/m·K.
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Low thermal impedance: ≤ 0.025 °C·in²/W.
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Excellent formability: fills irregular and variable gaps.
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Electrically insulating: safe for sensitive electronics.
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Stable material: non-drying and long-lasting performance.
Typical Applications
Widely used by mining farms, repair centers, OEM assemblers, and electronics workshops. Typical applications include GPU memory cooling, ASIC miners, smart phones, wireless charging modules, and high-density electronic components.
HY256 80g Thermal Putty Specifications
| Parameter |
Specification |
| Model |
HY256 |
| Color |
Green |
| Package |
80g tube |
| Thermal Conductivity |
≥ 6.0 W/m·K |
| Thermal Impedance |
≤ 0.025 °C·in²/W |
| Electrical Behavior |
Electrically insulating |
| Material Stability |
Non-drying, long-lasting |
| Formability |
Excellent — fills irregular gaps |
| Typical Applications |
GPU RAM / ASIC hashboards / wireless charging |
| Condition |
Brand New |
FAQ — HY256 Thermal Putty 80g
Q: HY256 vs HY234 vs HY268 — which conductivity tier?
A: HY234 (4 W/m·K) is the entry-level workhorse. HY256 (6 W/m·K) is the sweet spot for modern GPU memory and mid-power ASIC chips — substantial uplift over HY234 without the premium cost of HY268 (8 W/m·K). For high-power S21 / M60 hashboards, consider HY268.
Q: Putty vs thermal pad — when to use putty?
A: Thermal pads are fixed thickness — great when component heights are uniform. Putty adapts to variable heights and irregular surfaces — better for GPU memory arrays where individual chip heights vary, or VRM modules where you have mixed components. Putty also doesn't compress with age the way thermal pads do.
Q: How long does 80g last in a repair shop?
A: Per-GPU memory swap is typically 1-3g. 80g covers approximately 25-80 repair operations. For a shop doing 20-50 GPU repairs per month, one tube lasts 1-2 months.
Q: Bulk pricing for repair shops?
A: Yes — email contact@lys-sz.com with your monthly thermal interface volume for tier pricing.
Related products
Repair shops stocking HY256 80g tubes by the case? Email contact@lys-sz.com for bulk pricing. Worldwide shipping from our Shenzhen warehouses.