HY234 4.0W/m·K Pink Thermal Putty (80g Tube) for GPU RAM, ASIC & Electronics

HY234 Pink Thermal Putty – Flexible 4.0 W/m·K Thermal Interface Material

The HY234 Thermal Putty is a professional-grade thermal interface material designed to replace traditional thermal pads in applications requiring flexible gap filling and reliable heat transfer. With a thermal conductivity of ≥ 4.0 W/m·K, HY234 offers stable thermal performance for GPU RAM, ASIC miners, smart devices, and electronic modules.

Ideal Replacement for Thermal Pads in Variable Gap Applications

Unlike fixed-size thermal pads, HY234 thermal putty adapts easily to different component heights and surface irregularities. This ensures consistent contact between heat sources and heat sinks, improving cooling efficiency while simplifying installation during assembly or repair.

• Thermal conductivity: ≥ 4.0 W/m·K
• Low thermal impedance: ≤ 0.028 °C·in²/W
• Excellent formability: suitable for uneven surfaces
• Electrically insulating: safe for sensitive components
• Stable material: non-drying, long service life

Designed for Mining, GPU & Electronics Repair

HY234 is widely used by mining repair centers, electronics workshops, and OEM assemblers. Typical applications include GPU memory cooling, ASIC hashboards, smart phones, wireless charging modules, and compact electronic devices.

HY234 Thermal Putty Technical Specifications

B2B & Wholesale Supply:
HY234 thermal putty is available for bulk orders, mining farms, repair centers, and international export. For volume pricing and customized logistics solutions, please contact our sales team.

Quality Assurance:
All HY234 products supplied are original materials, subject to strict quality inspection. Technical documentation and compliance files can be provided upon request.

More options available:
For customers with different thermal performance or budget requirements, we also supply other thermal putty and thermal grease models. Please contact our sales department for tailored recommendations.