HY236 Pink Thermal Putty 6.0W/m·K – 80g High Performance Thermal Interface for ASIC, GPU & Electronics

HY236 High-Performance Thermal Putty for ASIC, GPU & Electronics Cooling

The HY236 Thermal Putty is a professional-grade thermal interface material designed to replace traditional thermal pads. With a thermal conductivity of 6.0W/m·K, it ensures efficient heat transfer between electronic components and heat sinks, even on uneven surfaces.

This putty-based solution is ideal for ASIC miners, GPU RAM, power components, and high-density electronics, offering excellent conformity, electrical insulation, and long-term stability.

Why Choose HY236 Thermal Putty

• Superior Heat Transfer – 6.0W/m·K thermal conductivity for demanding cooling applications
• Perfect Thermal Pad Replacement – Fills gaps of varying thickness without cutting or stacking pads
• High Electrical Insulation – Dielectric strength up to 5.2 KV/mm
• Stable in Harsh Environments – Reliable operation from -20°C to 150°C
• Professional Cartridge Format – Clean, precise application for repair shops and production lines

Typical Applications

• ASIC miners and hashboards
• GPU RAM and VRM cooling
• Mining machine power components
• Smartphones, laptops, and consumer electronics
• Industrial and embedded systems

Technical Specifications

Quality Assurance: This is an original product with strict quality control. Full documentation can be provided upon request.

B2B & Bulk Orders: As an exporter and B2B supplier, we offer bulk pricing and customized shipping solutions. Please contact our sales team for quotations.

Alternative Options: For customers with different performance or budget requirements, we also supply other thermal putty and thermal grease brands. Contact us for details.